SHIMONO MECHANICAL ENGINEERING Co., Ltd. — KYOTO, JAPAN

We etch the hardest
material on Earth.

Plasma process equipment for diamond and wide-bandgap semiconductors, from Kyoto, Japan.

global@si-mechanical.com
PROCESS CHAMBERProcess chamber: 6-inch dry etching
RFICP and bias on independent RF supplies (auto-match)
TRANSFERLoad-lock equipped
VACUUMTMP + dry pump, automated pressure control
COOLINGSubstrate He cooling
GASO₂, Ar, N₂, SF₆, CF₄ and more

What we do

  • Dry etching & deposition systems (6-inch) for diamond, SiC, Si, SiO₂, Si₃N₄, and W — materials for next-generation power semiconductors, high-voltage devices, and quantum/sensor applications
  • ICP source and substrate bias driven by independent RF power supplies, load-lock equipped, automated pressure control
  • Custom vacuum systems for universities and research institutes — delivered to leading Japanese national labs and universities
  • 20+ years of vacuum engineering since 2003: 50+ leak testing systems delivered, mainly to automotive production lines in Japan, China, Mexico, and Vietnam, plus helium recovery machines
  • NEDO-funded development of conductive DLC coating for fuel cells (ion-beam, room-temperature process)

SEMICON Taiwan 2026

We exhibited at SEMICON Taiwan 2026 (September 2–4, TaiNEX, Kyoto Pavilion, Booth Q6036). Thank you to everyone who visited our booth. Talk to our engineers about your etching challenges.

Contact

global@si-mechanical.com
Room 306, Kyoto City Growth Industry Creation Center, 105 Jibu-cho, Fushimi-ku, Kyoto 612-8374, Japan
TEL +81-75-748-6317